Thermoelectric Cooling Plate Semiconductor Cooler Heatsink TEC1‑26306 50 x 50mm 24V 6A

About this item

• Feature: 1. No need for any refrigerant, continuous work, no pollution source, no rotating parts, no rotation effect, no sliding part is a solid piece, no vibration, noise, long life, easy installation. 2. Semiconductor refrigeration fins have two functions, both cooling and heating. The cooling efficiency is generally 55-60percent , but the heating efficiency is always higher than 1, so using one can replace the separate cooling system and heating system. 3. Semiconductor refrigeration chip is a current‑transducer type chip. Through the control of input current, high‑accurate temperature control can be realized. Coupled with temperature detection and control means, it is easy to realize remote control, program control, and computer control to form an automatic control system. 4. The thermal inertia is small, and the cooling and heating time is fast. When the hot end has good heat dissipation and the cold end is empty, the cooling plate can attain the maximum temperature difference in less than one minute. 5. The reverse use of semiconductor refrigeration fins is thermoelectric power generation. Semiconductor refrigeration fins are generally suitable for power generation in the middle and low temperature areas. 6. The power of a single refrigeration component pair is very small, but it is combined into a pile. If the same type of pile is used in series and parallel to form a refrigeration system, the power can be very large, so the cooling power can be up to several milliwatts. The range of ten thousand watts. 7. Normal temperature hot exterior can withstand temperature of 80 degrees, medium temperature hot exterior can withstand temperature of 150 degrees, high temperature hot exterior can withstand temperature of 200 degrees; the temperature difference between hot end and cold end can attain 67 degrees, level two can attain 80 degrees, level three can attain 90 degrees, the fourth level reaches 107 degrees. Specification: Item Type: Thermoelectric Cooling PlateModel: TEC1-26306 Material: Ceramic Rated Voltage: DC24V Maximum Voltage: DC30V (Th=30 celsius ) Maximum Current: 6A (U=30V, Th=30 celsius ) Maximum Temperature Difference: 66 celsius (Qc=0,Th=30 celsius ) Maximum Cooling Capacity: 107W (△T=0 celsius ,Th=30 celsius ) Internal Resistance: 3.7-4.3 Ohm Lead Specification: 20AWG, L=150mm Packaging Process: 704 silicone rubber sealing Assembly Pressure: 6kg Working Temperature: -50~+80 celsius Storage Temperature: -40~+60 celsius Application Range: 1. Applications In High-tech Fields: Satellites, semiconductor lasers, infrared thermal imaging, infrared detectors, optoelectronic devices, etc. 2. Home Appliance Applications: Dehumidifiers, portable heating and cooling boxes, hot and cold water dispensers, cool helmets, cold drink cups, beverage wine coolers, etc. 3. Application In Electronic Technology: Cooling of electronic equipment, electronic components, computers, etc. 4. Industrial Applications: Automobile refrigerators, small air conditioners, dehumidifiers, thermostats, petroleum testing instruments, etc. 5. Agricultural And Biological Applications: Physical cooling pads, semiconductor physiological slices, vaccine preservation, etc.. Package List: 1 x Semiconductor Cooling Film