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Tin Solder Paste BGA Soldering Flux Repairing Tool Accessories
Fishine|SKU 20156vdfdswv
About this item
- Features: Good moisturizing, bright and full solder joint, little smoke, no irritating smell. Less residual, high insulation resistance, high activity, strong welding force. Easy to weld, can protect BGA traces from corrosion and moisture. Good wetting, dry resistance, long shelf life at room temperature Used for high precision circuit board SMT welding, BGA process welding, CPU tin planting, etc. Specification: Viscosity: 200 (Pa. S) Granularity: 2445 (um) Product size: 37 * 20mm 1.5 * 0.8in Alloy components: Sn63 Activity: high activity Melting point: 183 celsius Temperature: 220~380 celsius Package List: 1 x Solder Paste .Good moisturizing, bright and full solder joint, little smoke, no irritating smell. Less residual, high insulation resistance, high activity, strong welding force. Easy to weld, can protect BGA traces from corrosion and moisture. Good wetting, dry resistance, long shelf life at room temperature Used for high precision circuit board SMT welding, BGA process welding, CPU tin planting, etc.
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Price
£16.60
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Product information
| Delivery Cost | 3.0 |
|---|---|
| Delivery Time | 10 - 22 |
| In Stock | InStock |
| Is Translated | true |
| Language | en |
| Shipping | 3.0 |
| Special Category Commission | default |