LP200 Manual Vacuum Sucker Suction Pen Soldering Sucking Pickup Tool for IC

About this item

• Vacuum suction pen suction electronic parts and small products is particularly convenient, vacuum suction pen is the principle of atmospheric pressure difference to absorb components of a tool, the use of vacuum suction pen pick components compared with the use of tweezers pick components, can greatly avoid bumping the peripheral components. Features: 1. Vacuum Suction Pen Tip: Vacuum Suction Pen Tip: Can withstand high temperature air flow at 500 celsius for 60 seconds, can be used continuously. 2. Easy to Use: Builtin small powerful vacuum pump, no need to connect any straw or power cord, easy to use at any time. 3. Antistatic Vacuum Pen: Simple operation, antistatic, nonpolluting product surface, moving fast and light. 4. Multiple Sizes Available: Vacuum suction tips are available in a variety of sizes to accommodate different sizes of chips. 5. Application: generally used in SMT and other industries to absorb IC components. Specification: Condition: 100percent Brand New Item Type: Vacuum Sucker Pen Model: LP200 Color: Shown as Picture Vacuum pen is available in straight and curved heads, it comes standard with three sizes of tips: LN250: FACE SIZE 18 DIA. 3.2mm LN260: FACE SIZE 14 DIA. 6.4mm LN270: FACE SIZE 38 DIA. 9.5mm Package List: 1 * Vacuum Suction Pen 3 * acuum Suction Pen Tips Note: 1. Please allow slight error due to manual measurement. Thanks for your understanding. 2. Monitors are not calibrated same, item color displayed in photos may be showing slightly different from the real object. Please take the real one as standard. Vacuum Suction Pen Use Method: When in use, aim the suction disc of the vacuum suction pen at the middle of the BGA element, then suck the component and remove it. (In between the BGA, the surface of the component should be cleaned well, otherwise it will affect the suction of the vacuum suction pen) 1. First select the suction cup that corresponds to the size of the IC to be drawn and installed on the suction pen nozzle. 2. After the suction pen is installed, place the suction cup flat on the IC. 3. Press the button on the suction pen to remove air from the vacuum device inside the pen, then release the button pen to produce vacuum suction to lift the IC 4. Place the suction IC in the position to be placed and press the button to remove air from the vacuum device in the pen so that the IC will fall off the suction cup. Vacuum Suction Pen Tip: Vacuum Suction Pen Tip: Can withstand high temperature air flow at 500 celsius for 60 seconds, can be used continuously. Easy to Use: Builtin small powerful vacuum pump, no need to connect any straw or power cord, easy to use at any time. Antistatic Vacuum Pen: Simple operation, antistatic, nonpolluting product surface, moving fast and light. Multiple Sizes Available: Vacuum suction tips are available in a variety of sizes to accommodate different sizes of chips. Application: generally used in SMT and other industries to absorb IC components.